What is a Track System?Photlithography is a well understood process that has been used since industry was established.
A "track" sequentially processes semiconductor wafers for coating or developing. A coater, creates a uniform layer of photoresist as the wafer is spun prior to being placed in a exposure tool.
The exposed wafer is developed by dispensing liquid chemical on a developer track.
A track system is a generic term used for describing this small process line which can include hotplates, adhesion promotors (HMDS - Vapor Prime) or scrubbing and cleaning stations.
Defining a track system can be quite difficult so we provide on-site meetings for design and work with you every step of the way.
Coating Modules and PumpsPhotorestist is dispensed in a known repeatable quantity as the wafer speed is ramped to produce a uniform layer. Photoresist can be either "positive" or negative" and are usually pumped. Depending on the viscosity of the material being dispensed special pumps or techniques may be required. Consideration is required of waste disposed, pump priming, catch cup cleaning etc depending on resisit to be used.
Single Wafer & R+D Processing
In many small throughput applications such as R+D then it is uneconomic to have dedicated track systems so small benchtop resist spinners with syringe dispense or manual syringe, and hotplates are available. In basic and small scale R+D development of wafers is achieved by placing the wafers into a beaker of developer, but then manual spinner-developers may be required for more consistent results.
In basic and small scale R+D development of wafers is achieved by placing the wafers into a beaker of developer, but then manual spinner-developers may be required for more conisitant results
Process & Technology
Coating: Photo Resisit, SOG, Conformal CoatingsThe spinning process is used to ensure a uniform layer of material. Most materials used, consist of a active component and carrier vehichle to make a solution that can flow acoss the subtrate and the action of the spinning spreads the liquid evenly across the surface.
Thickness of the layer and uniformity depend on the viscosity of the material, spin speed and ramp steps along with dydnamic dispense if required (moving the dispense nozzle during the dispense process). Several dispense nozzles are often used to allow multiple materials to be dispensed. Special features may be required in the dispense systems to ensure process consisitency - such as pre-dispense, edgebead removal, suck-back control, bubble removal etc.
Upgrades, Repair Training :
From newly designed and built systems to upgrading tools either in the field or back at the factory we can provide a cost effective solution