Wafer Dicing Saws, Blades, Lasers and Process
Dicing and SingulationGetting a process that is both consistent, efficient and cost effective is not easy so we can help you with several solutions. We understand the issues of the process and the risks to your devices at this very vulnerable stage. Dicing can also induce failures that impact yield significantly.
- Kerf Control
- Corrossion inhibition
- Blade Life
- Structures & dust traps
- Device Relaibility
- Thin or stressed wafers
- Laser or traditionalal cutting
Most people don't understand fully that long term reliability of devices can be infulenced greatly by this process step. Its very important to get it right!
Diamond Blade or Laser
We provide new tools from Accretech the world leader in automatic probing, dicing, and grinding solutions.
Diamond Blade Dicing
Stealth Dicing (Laser)
Dicing as a Service
Wafers can be diced in Europe depending on need - please contact us for details
Protect or make more profit!
Blade life, chipping and kerf control as well as bond strength and long term corrossion can all impact product lifetime and costy return or recalls.
Diamaflow is proven to work!
Corrosion without Diamaflow
No Corrosion with Diamaflow